发明名称 |
Method and apparatus for polishing work |
摘要 |
There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 wherein temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work. |
申请公布号 |
US6399498(B1) |
申请公布日期 |
2002.06.04 |
申请号 |
US19990244697 |
申请日期 |
1999.02.04 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
MASUMURA HISASHI;SUZUKI FUMIO;OKAMURA KOUICHI |
分类号 |
B24B37/00;B24B37/015;B24B37/04;B24B49/14;H01L21/304;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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