| 发明名称 |
Process of drying semiconductor wafers using liquid or supercritical carbon dioxide |
| 摘要 |
A process of drying a semiconductor wafer which includes at least one microelectric structure disposed thereon which includes contacting a water-containing thin film-covered semiconductor wafer with a composition which includes liquid or supercritical carbon dioxide and a surfactant.
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| 申请公布号 |
US6398875(B1) |
申请公布日期 |
2002.06.04 |
| 申请号 |
US20010893231 |
申请日期 |
2001.06.27 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COTTE JOHN MICHAEL;GOLDFARB DARIO L.;MCCULLOUGH KENNETH JOHN;MOREAU WAYNE MARTIN;POPE KEITH R.;SIMONS JOHN P.;TAFT CHARLES J. |
| 分类号 |
H01L21/00;H01L21/02;H01L21/306;(IPC1-7):B08B3/04 |
主分类号 |
H01L21/00 |
| 代理机构 |
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