发明名称 ORGANOCOPPER COMPOUND, MIXED SOLUTION CONTAINING THE COMPOUND AND COPPER THIN FILM FORMED USING THE SOLUTION
摘要 PROBLEM TO BE SOLVED: To obtain an organocopper compound and a solution containing the same which are hardly decomposed in a storage state before film forming and have a long life, and further which have a higher film forming speed, decompose efficiently on a substrate to have high volatility and are excellent in adhesion with a ground film. SOLUTION: The organocopper compound is expressed by the formula (1), and it is obtained by coordinating 1,1,1,5,5,5-hexafluoro2,4-pentanedione and a compound having an alkynol group with a monovalent copper. In the formula, X1 and X2 are same to or different from each other, and they are each H, a 1-7C alkyl, a silyl group or a hydroxyl-containing group.
申请公布号 JP2002161098(A) 申请公布日期 2002.06.04
申请号 JP20000302407 申请日期 2000.10.02
申请人 MITSUBISHI MATERIALS CORP 发明人 SAI ATSUSHI;OGI KATSUMI
分类号 C07F1/08;C23C16/18;H01L21/28;H01L21/285;(IPC1-7):C07F1/08 主分类号 C07F1/08
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