ELECTRO-CONDUCTIVE ADHESIVE, ELECTRONICS PACKAGING STRUCTURE, AND METHOD FOR FABRICATING ELECTRONICS PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a anelectronics packaging structure which hardly causes ion migration and sulfuration. SOLUTION: This electro-conductive adhesive comprises a binder resin 2, electro-conductive particles 3, and an elution-preventing film-forming agent 4, characterized in that the elution-preventing film-forming agent 4 reacts after the development of electric conduction through the electro-conductive particles 3 in the electro-conductive adhesive on the curing of the binder resin 2 to form an elution-preventing film 5 on the surface of the electro-conductive particles 3. The employment of the electro-conductive adhesive gives the electronics packaging structure which hardly causes ion migration and sulfuration.