发明名称 |
Method and apparatus for cooling electronic components |
摘要 |
The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.
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申请公布号 |
US6400568(B1) |
申请公布日期 |
2002.06.04 |
申请号 |
US20010903351 |
申请日期 |
2001.07.11 |
申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
KIM DAVID K. J.;RUCKMAN WILLIAM W.;STRUVE DIMITRY |
分类号 |
G06F1/20;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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