IMPREGNATING, CASTING AND COATING COMPOSITIONS FOR ELECTRICAL AND/OR ELECTRONIC COMPONENTS AND FOR CARRIER MATERIALS FOR SHEETLIKE INSULATING MATERIALS

摘要

The invention concerns the use of a resin compound (A) as impregnating, casting and coating compounds for electrotechnical and/or electronic components and for carrier materials for plane insulating materials. The res in compound (A) contains: A1) at least one unsaturated polyester resin; A2) at least one vinylether with a viscosity of less than 4000 mPa.s at 25 ~C; A3) optionally at least one further polymer and/or oligomer; A4) optionally at least one curing accelerator; A5) optionally at least one ethylenically unsaturated reactive thinner; and A6) optionally further conventional additives. The invention further concerns coating compounds which cure with low emission and are suitable for this purpose.