发明名称 |
POSITIVE RESIST COMPOSITION |
摘要 |
PURPOSE: To provide a chemically amplifying positive resist composition of high resolution which is excellent in the resistance to dry etching and adhesion to a substrate, giving a good form of the resist pattern improved in line edge roughness. CONSTITUTION: The chemical amplifying positive resist composition includes (A) a resin component which is enhanced its solubility in an alkaline solution by the action of an acid, (B) an acid generating component which generates an acid by the exposure of a radiation and (C) an organic solvent. The composition of (A) is a poly(meth)acrylate of which (meth)acrylate units of the main chain containing a dissolution inhibiting group are at least partially replaced with esters induced from a (meth)acrylic acid and a lactone-ring containing bridged saturated polycyclic alcohol or those induced from a (meth)acrylic acid and a linear alcohol substituted with hydroxyl, alkoxyl or acyl groups.
|
申请公布号 |
KR20020041310(A) |
申请公布日期 |
2002.06.01 |
申请号 |
KR20010074100 |
申请日期 |
2001.11.27 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
FUJIMURA SATOSHI;HADA HIDEO;IWAI TAKESHI |
分类号 |
C08F220/26;C08K5/00;C08K5/17;C08L101/00;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 |
主分类号 |
C08F220/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|