| 摘要 |
A liquid processing apparatus includes a liquid processing unit 30 for supplying objects to be processes, such as wafers W, with a processing liquid for liquid processing, a processing-liquid supplying unit 100 for supplying heated processing liquids 12a, 12b to the liquid processing unit 30 and a heating unit 200 for heating the liquids 12a, 12b up to a predetermined temperature. The heating unit 200 has a heater 16 for heating the liquids 12a, 12b, a power supply circuit for supplying the heater 16 with electricity, a temperature sensor 14 and a temperature regulator 13 both forming an output control unit for controlling an output from a power source 20 to the heater 16, a solid state relay 19 for switching on/off the operation of the power supply circuit by signals from the temperature regulator 13, and failure detecting units. The failure detecting units include a contact monitor 1 for monitoring an ON/OFF contact 32 in a power switch 21, a primary-side signal detecting monitor 2 for detecting ON/OFF signals from the temperature regulator 13 to the solid state relay 19, and a secondary output voltage detecting monitor 4 for detecting secondary-side ON/OFF signals of the solid state relay 19, providing a heating device capable of determining the cause of failure finely and also the liquid processing apparatus using the heating device, which is used for applying a designated liquid processing to various kinds of substrates, for example, semiconductor wafers, LCD substrates, etc.
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