TAPE CARRIER, SEMICONDUCTOR ASSEMBLY, AND SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURE THEREOF, AND ELECTRONIC INSTRUMENT

摘要

A tape form substrate has a plurality of semiconductor elements arrayed in a central portion in the longitudinal direction, and first and second patterns extend laterally from the central portion of the substrate; each of the patterns comprises a plurality of wires having bonding portions with the semiconductor elements, external terminal portions connected to the bonding portions, and lead-out portions extending from the external terminal portions to the outside; and the wires are formed in a plurality of groups, with the ends of the lead-out portions of each group of wires disposed in a fixed pattern.