| 发明名称 |
Semiconductor device, and a method of producing semiconductor device |
| 摘要 |
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.
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| 申请公布号 |
US2002064903(A1) |
申请公布日期 |
2002.05.30 |
| 申请号 |
US20020032578 |
申请日期 |
2002.01.02 |
| 申请人 |
KAWATA YOUICHI;KOIZUMI KOUJI;SUGIYAMA MICHIAKI;FUJISHIMA ATSUSHI;NAKAJIMA YASUYUKI;HAGIWARA TAKATOSHI |
发明人 |
KAWATA YOUICHI;KOIZUMI KOUJI;SUGIYAMA MICHIAKI;FUJISHIMA ATSUSHI;NAKAJIMA YASUYUKI;HAGIWARA TAKATOSHI |
| 分类号 |
H01L23/28;H01L21/50;H01L21/56;H01L21/60;H01L23/04;H01L23/31;H01L23/495;H01L23/50;(IPC1-7):H01L21/44;H01L21/48;H01L23/34 |
主分类号 |
H01L23/28 |
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