| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module device of a structure that a mounting of an external component on a module is enabled to utilize lead terminals led out from the sealing part of the module to the outside, the reliability of the connection parts of high-current components is ensured to enable to contrive the stabilization of the quality of the components without exerting any effect on the module, and furthermore, a miniaturization of the device is enabled to link the miniaturization to a reduction in the cost of the device. SOLUTION: An electronic component module device is formed in a constitution that mounting parts 23a, 23b, 24a, 24b, 25a and 25b of an external component are respectively provided on some of a plurality of lead terminals 22a to 22i led out from a sealing part 20 of a module 8 to the outside. |
