| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for packaging electronic components where a sealing resin can be molded relatively easily, and fail or the like due to the outflow of the sealing resin can be reduced. SOLUTION: The manufacturing method of a substrate for packaging electronic compounds comprises an insulating base 11, wiring patterns 12, 13, and 14 formed on one surface of the insulating base 11, and a solder resist layer 16 for covering a surface, excluding the terminal section of the wiring patterns 12, 13, and 14. After the electronic components have been packaged, a junction section with the electronic components is molded the sealing resin. The manufacturing method comprises a process for forming the application layer of a photosolder resist material that becomes the solder resist layer 16, a process for the application layer to light via a photomask 50 having a specific pattern, and process for patterning the application layer by developing the application layer of the photosolder resist material that is exposed to light and for forming at least one step section 20, where the thickness of a region side that is sealed by resin becomes relatively thinner at the boundary between the molded region and the surrounding region. |
