| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of there being locations that could not be soldered normally, if soldering is made, using a soldering device when a printed circuit board is warped, since the solder jet surface of the conventional automatic soldering device is flat, and hence a warpage-preventing tool is used to correct warpages, when the printed circuit board is warped, or to prevent warpages from being generated when the warpage occurred, and many man- hours are required to mount or remove the tool, even though the tool has been manufactured to be detachable. SOLUTION: The automated soldering device has a means for measuring the height of each divided end face from the reference surface by detecting a transport mechanism for carrying the printed circuit board and the front end face of the printed circuit board, and dividing the end face, and at the same time, a plurality of solder jet nozzles that are provided corresponding to each end face that has been divided. Each of the solder jet nozzles controls the height of solder jet, corresponding to height information obtained by the height measurement means.
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