| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a thin crystal vibrator. SOLUTION: This invention provides a manufacturing method for a package of a crystal vibrator that is characterized by that anisotropic etching is applied to a silicon substrate to form a recessed part to the surface of the substrate, a crystal chip is mounted on a circuit substrate with a circuit pattern formed thereto, and the recessed part of the substrate is covered and sealed.
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