SUBMOUNT, ELECTRONIC ASSEMBLY, AND PROCESS FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To offer a submount for electronic components which can reduce a cross-talk among the electronic components. SOLUTION: This submount for electronic components comprises a surface provided with a first contact area for electric contact of one electronic component, and a second contact area of the opposite polarity. Then it comprises a depression filled with a dielectric provided with a metal film at least beneath the position at which the first contact area is located. The metal film is electrically connected to the second contact area.