发明名称 TOOL FOR THERMO-COMPRESSION-BONDING CHIPS, AND CHIP PACKAGING DEVICE HAVING THE SAME
摘要 A ceramic holder (2) is mounted on the lower end of a connecting block (30) of metal mounted on the lower end of a tool main body (1) of metal, such ceramic holder (2), a ceramic heater (4) and a ceramic presser (5) being sintered. In addition, the linear expansion coefficient of the ceramic holder (2) is approximately equal to those of the ceramic heater (4) and ceramic presser (5); furthermore, the heat transfer coefficients of the ceramic holder (2) and ceramic presser (5) are greater as the pressure surface side of the ceramic presser (5) as seen from the ceramic heater (4) is approached and are smaller as the attaching surface side of the ceramic holder (2) is approached.
申请公布号 WO0241385(A1) 申请公布日期 2002.05.23
申请号 WO2000JP08091 申请日期 2000.11.16
申请人 TORAY ENGINEERING CO., LTD.;YAMAUCHI, AKIRA;ARAI, YOSHIYUKI 发明人 YAMAUCHI, AKIRA;ARAI, YOSHIYUKI
分类号 H01L21/00;(IPC1-7):H01L21/52;H01L21/60;H01L21/603 主分类号 H01L21/00
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