MICROELECTRONIC PACKAGE HAVING IMPROVED LIGHT EXTRACTION
摘要
A light-emitting package (510) includes a substantially transparent substrate (526) having a first surface (550) and a second surface (552), and a light-emitting diode (LED) (518) adapted to emit light having a predetermined wavelength, the LED (518) being secured over the first surface (550) of the substantially transparent substrate (526). The second surface (552) of the substrate defines a principal light emitting surface of the package, and includes a grating pattern (554) that matches the predetermined wavelength of the light emitted from the LED (518) for controlling the emission geometry of the light emitted by the package.
申请公布号
WO0241406(A1)
申请公布日期
2002.05.23
申请号
WO2001US44047
申请日期
2001.11.14
申请人
EMCORE CORPORATION;ELIASHEVICH, IVAN;KARLICEK, ROBERT, F., JR.;VENUGOPALAN, HARI
发明人
ELIASHEVICH, IVAN;KARLICEK, ROBERT, F., JR.;VENUGOPALAN, HARI