| 摘要 |
PURPOSE: A metal soldering structure and a method thereof are provided to obtain easy bonding and good bonding feature by providing metal soldering structure without containing harmful materials in a flux. CONSTITUTION: A metal soldering structure comprises a first bonding member(21) consisting of Fe, a second bonding member(22) consisting of Fe, and a flux layer(23) consisting of Sn and Ag and formed on a bonding face of the first and second bonding members. The first and second bonding members consist of any one element including Cu, Al, Ni, Sn or stainless steel. Soldering method comprises the following steps. In a first step, the first bonding member is provided which consists of any one element including Fe, Cu, Al, Ni, Sn or stainless steel. In a second step, the second bonding member is provided which consists of any one element including Fe, Cu, Al, Ni, Sn or stainless steel. In a third step, a flux consisting of Sn and Ag is supplied to the bonding face of the first and second bonding members.
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