| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a porous polyimide comprising a microcell structure and having heat resistance and a low dielectric constant. SOLUTION: This method for producing a porous polyimide is characterized by adding a dispersible compound to a polyimide precursor, forming a microphase-separated structure having <10μm average diameter in a polymer, then extracting and removing the dispersible compound with supercritical carbon dioxide and porosifying the resultant material, where the interaction parameter (χAB) between the polyimide precursor A and the dispersible compound B is 3<χAB to obtain a porous polyimide having <5μm average cell diameter and <=3 dielectric constant.</p> |
