| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive film which has excellent adhesion and etching durability for a supporting body and which can form a good resist profile and to provide a printed circuit board obtained by using the film. SOLUTION: The printed circuit board is obtained by using the photosensitive film prepared by laminating the following photosensitive resin composition. The photosensitive resin composition contains (A) ethylenically unsaturated compounds expressed by general formula (I) by 3 to 20 pts.wt., (B) ethylenically unsaturated compounds except for the compounds (A) by 15 to 40 pts.wt., (C) polymer compounds having carboxyl groups by 50 to 70 pts.wt. (however, the total amount of the components (A), (B), and (C) is controlled to 100 pts.wt.), and (D) a photoinitiator by 0.05 to 20 pts.wt. to the total 100 pts.wt. of the components (A), (B) and (C). In formula (I), R1 is a hydrogen atom or a methyl group, R2 is a hydrogen atom or a 1-4C alkyl group, R3 is a 4-14C alkyl group, n is an integer 3 to 20, and m is an integer 1 to 3. |
