发明名称 |
Solder paste |
摘要 |
A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn-Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn-Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.
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申请公布号 |
US6391123(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US20010970036 |
申请日期 |
2001.10.04 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
NAKAMURA SINZO;KURATA RYOICHI;TAKAHASHI HIROSHI |
分类号 |
B23K35/22;B23K35/02;B23K35/26;B23K35/36;C22C13/00;C22C13/02;H05K3/34;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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