Exhaust device for use in a clean room, cleanroom, and method

摘要

In a single cleanroom (200) for first (230) and second (240) wafer processing machines, an exhaust device (260) surrounds the second machine (240) that temporarily produces exhaust gas (250) which is detrimental to the processes in the first machine (230). Additionally to a first directed air flow (220) available in the cleanroom (200), the exhaust device (260) generates-in the proximity of gas leakage openings of the second machine (240)-a second air flow (270) that prevents the exhaust gas (250) from further being moved by the first air flow (220) to the first machine (230).