IC package transfer and relocation mechanism

摘要

A transfer mechanism for transferring molded IC device packages or the like between different types of trays which have IC package holder nests in differently spaced arrays. The transfer mechanism includes a suction gripper assembly supported on a horizontally and vertically movable robot arm, and having four suction heads mounted separately on four support blocks on a mounting plate. The four support blocks consist of a first support block fixed in a predetermined reference position on the mounting plate, second and third support blocks movably supported on the mounting plate for movements toward and away from the first support block in perpendicularly intersecting directions, and a fourth support block movably supported on the mounting plate for movements toward and away from the first support block in a diagonal direction following movement of at least one of the second and third support blocks.