| 摘要 |
A circuit board structure is described for facilitating engineering changes for a multichip module mounted on the circuit board. The structure includes a first layer of a conductive material overlying a portion of a surface of the circuit board, and a second layer overlying the first layer and in contact therewith. The second layer has openings therein; bonding pads are formed in the openings of the second layer. The bonding pads are of a conductive material and in contact with the first layer. The multichip module is surrounded by a hermetic seal on the second layer, so that a first bonding pad is inside a hermetically sealed area of the circuit board and a second bonding pad is outside the hermetically sealed area. An engineering change of the multichip module is performed by connecting the multichip module to the first bonding pad by a first wire inside the hermetically sealed area, and by connecting a second wire to the second bonding pad outside the hermetically sealed area.
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