发明名称 |
Method of fabricating a laminated circuit assembly and product thereof |
摘要 |
A method of fabricating a laminated circuit assembly and the assembly made therefrom including the steps of providing a relatively stiff substrate. A U-shaped slit is cut in the substrate in an area where a peripheral pull tab subsequently is to be located. The side legs of the U-shaped configuration define spaced slit portions. A relatively flexible backing sheet is adhered to a back side of the substrate. The laminated substrate and backing sheet are cut with a peripheral cut intersecting the side legs of the U-shaped slit, with the peripheral cut forming a pull tab projecting outwardly from the U-shaped slit. The pull tab can be grasped and separated from the substrate to strip the backing sheet therefrom.
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申请公布号 |
US6391138(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US19990399824 |
申请日期 |
1999.09.20 |
申请人 |
MOLEX INCORPORATED |
发明人 |
BABLEE BRUNO;MALONE MICHAEL |
分类号 |
H05K3/00;(IPC1-7):B32B31/18 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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