Hermetically sealed package for a silicon carbide semiconductor device

摘要

A system includes a silicon carbide (SiC) semiconductor device (100) and a hermetically sealed packaging (130) enclosing the SiC semiconductor device. The hermetically sealed packaging is configured to maintain a particular atmosphere (132) near the SiC semiconductor device. Further, the particular atmosphere limits a shift in a threshold voltage of the SiC semiconductor device to less than 1 V during operation.