| 摘要 |
PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided to improve reliability of a semiconductor device by improving a composition of an epoxy resin. CONSTITUTION: An epoxy resin composition is formed with a mixture of an ortho-cresol-novolac-based epoxy resin formed by the first chemical reaction formula and a hetero-bi-functional epoxy resin of 3.0 to 12 weight percents formed by the second chemical reaction formula, a hardener of 2.0 to 6.5 weight percents formed by the third chemical reaction formula, an accelerator of 0.1 to 0.3 weight percent, an amine denatured silicon oil of 0.1 to 10 weight percent, an inorganic absorbing agent of 82 to 90 weight percents. A mixed weight ratio of the mixture of the ortho-cresol-novolac-based epoxy resin and the hetero-bi-functional epoxy resin is 2 to 8 or 6 to 4.
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