MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device and a semiconductor wafer for realizing an efficient probe inspection while reducing an integrated circuit chip. SOLUTION: Pads 4c and 4d for tests are provided on a division line 2 dividing a plurality of the integrated circuit chips 1. Switching circuits 6a-6d for turning ON/OFF the connection of a test circuit 3 inside the plurality of the integrated circuit chips 1, and the pads 4c and 4d for the tests arranged on the division line and switching pads 7a-7d for inputting switching signals for switching the switching circuits, are formed on the division line 2. Since the pads 4c and 4d for the tests, the switching circuits 6a-6d, and the switching pads 7a-7d on the division line are cut off at the time of division; a chip size is miniaturized without increasing the area of the semiconductor circuit chip 1.