| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed circuit board having an inexpensive polyethylene terephthalate film layer as a base layer in which warp and bend are retarded at the time of surface mounting a component by soldering and reflow. SOLUTION: In the flexible printed circuit board having a polyethylene terephthalate film layer, the polyethylene terephthalate film is previously heat treated.
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