| 摘要 |
PROBLEM TO BE SOLVED: To enable an injection of an ultraviolet curable adhesive efficiently and suitably and to uniformly cure the injected adhesive. SOLUTION: An electronic component bonding apparatus comprises an optical pickup body 1 fixed onto a base 8, and a chip 2 with a photodiode sucked from a moving element 10 to a distal end 11a of an arm 11 extended upward of the base 8. Thus, the element 10 is moved to bring a center O1 of the photodiode into coincidence with an axial center O2 of an objective lens. The ultraviolet curable adhesive is then injected between both edges 2a of the chip 2 and both edges 5 of a chip installing surface 12a of the body 1, and an ultraviolet ray is then emitted to cure the adhesive. The axial center O3 of the distal end 11a of the arm is set to be substantially brought into coincidence with a centerline O4 extended along both the edges 5 of the surface 1a through the axial center O2 of the lens OL as seen in plane.
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