APPARATUS FOR BONDING ELECTRONIC COMPONENT AND BONDING TOOL

摘要

PROBLEM TO BE SOLVED: To provide a bonding tool capable of efficiently utilizing a vibration without bringing about a damage of an electronic component and an apparatus for bonding using the bonding tool. SOLUTION: The bonding tool press bonds the electronic component by a load and a vibration. The tool comprises a junction operating part 30 projected at a position corresponding to an antinode of a standing wave vibration of a horn 15 to be transmitted with the longitudinal vibration from a vibrator to contact with the component to press the component, and a through hole 31 of a direction perpendicular to a longitudinal vibration direction and a projecting direction of a junction operating part 30. Thus, a vertical vibration components of the vibration induced by a resonance of the longitudinal vibration of the horn 15 to the part 30 can be suppressed as much as possible, and the vibration can be efficiently utilized without damage at the component.