| 摘要 |
The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, which includes a semiconductor chip mounted on a carrier substrate, enables the semiconductor device to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.
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