| 摘要 |
The contacting method has the active chip sides of a number of semiconductor chips positioned in chip bonding positions on a flexible substrate using an adhesive fluid or paste, before fixing via a common chip fixing tool (10). The semiconductor chips are initially positioned in a required layout on an intermediate surface, with subsequent transfer to the flexible substrate via a chip transfer tool having recesses for each of the chips and hardening of the adhesive via application of heat and pressure via the chip fixing tool. An Independent claim for a semiconductor chip contacting device is also included.
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