Polymeric substrate circuit protection device and method of making the same

摘要

The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device. The highly conductive composite material has more than twenty times the conductivity of the conductive composite material so as to ensure that among connected electrodes inside the plaque-shaped composite material, current mainly flows through the highly conductive composite material rather than the conductive composite material of positive temperature coefficient thermal sensitive resistance.