| 摘要 |
<p>A holding device for electronic part test, comprising a holding head (102) for detachably holding and transferring an IC chip (110) to connect the IC chip (110) to the connection terminal (112) of a test socket (114), the holding head (102) further comprising a heater (111) capable of heating the IC chip (110) and a cooling nozzle (117) capable of cooling the IC chip (110), wherein, while the IC chip (110) is transferred by the holding head (102), the IC chip (110) is heated by the heater (111) and cooled by the cooling nozzle and, while the IC chip (110) is pressed against the connection terminal (112) by the holding head (102), the IC chip (110) is heated by the heater (111) and the heater (111) and the volume and/or temperature of the air blown out from the cooling nozzle (117) are controlled by a controller (130) so that the cooling by the cooling nozzle (117) can be stopped or lowered.</p> |
