SUBSTRATE WITH WARPAGE CONTROL PATTERN AND GROUP-ENCAPSULATED HALF-FINISHED SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A group-encapsulated half-finished semiconductor chip package is provided to prevent warpage by compensating for the difference of shrinkage ratios caused by an average thermal expansion ratio in upper and lower portions with respect to the thickness center of the semiconductor chip package. CONSTITUTION: A substrate(17) has an upper surface to which a plurality of semiconductor chips(15) are attached. A warpage control pattern(11) is formed in a region between the semiconductor chips of the substrate. An encapsulating part(13) encapsulating the semiconductor chips is formed on the upper surface of the substrate.