| 摘要 |
PURPOSE: A ball grid array(BGA) package is provided to improve a heat radiating capacity of the package, by transmitting the heat of a chip to a chip connection pin such that the heat is generated by direct contact between the lower surface of the chip and the chip connection pin and by radiating the heat to the outside through a circuit board and a solder ball. CONSTITUTION: A plurality of finger units(110) are formed on the upper surface of the circuit board(1). Via holes connected to the respective finger units are formed inside the circuit board. The semiconductor chip(2) is attached to the upper surface of the circuit board. Adhesive(4) is interposed between the semiconductor chip and the circuit board. The chip connection pin is positioned inside a semiconductor chip adhesion region of the circuit board. The lower end portion of the chip connection pin is connected to the via hole on the circuit board, and the upper end portion of the chip connection pin is in contact with the lower surface of the chip. A conductive connecting member electrically connects the finger units formed in a bonding pad(200) of the semiconductor chip and in an upper layer of the circuit board. A mold body surrounds and protects the bonding pad of the semiconductor chip, the conductive connecting member and the finger units. The solder ball(5) is attached to the lower surface of the circuit board.
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