发明名称 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide an electroconductive resin composition and its molding having excellent fluidity, rigidity, low warp, electromagnetic shielding and flame- retardancy at thin gage. SOLUTION: This electroconductive resin composition comprises 99.5 to 70 wt.% of a polycarbonate resin (A) and 0.5 to 30 wt.% of a silicon-containing polymer (B) each based on the total of (A) and (B), and further comprises 1 to 30 pts.wt. of a phosphoric acid ester (C) expressed by formula (1) and 5 to 200 pts.wt. of carbon fiber each to 100 pts.wt. of the total of (A) and (B).
申请公布号 JP2002138192(A) 申请公布日期 2002.05.14
申请号 JP20000336660 申请日期 2000.11.02
申请人 TORAY IND INC 发明人 UMETSU HIDEYUKI;SHINODA FUMIE;MAKABE YOSHIKI
分类号 C08J5/00;C08K5/523;C08K7/06;C08L69/00;C08L85/02;(IPC1-7):C08L69/00 主分类号 C08J5/00
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