发明名称 Lead out structure for lead circuit section of flexible printed circuitry
摘要 A pair of bosses are formed in the vicinity of a cut out portion of a lower casing from which a lead circuit section, which is integrally formed with a switch circuit section a flexible printed circuitry is led out. Three engagement holes are arranged in a longitudinal direction of the lead circuit section with predetermined intervals at both end portions of a widthwise direction thereof. The lead circuit section is folded such that all the respective three engagement holes are fitted with the respective bosses while providing surplus length portion in the form of S-shape, and then led out from the cut out portion. The upper casing having a pair of hold-down members are combined with the lower casing such that the hold-down members are engaged with the respective bosses to constitute a casing which serves as a switch unit.
申请公布号 US6388883(B1) 申请公布日期 2002.05.14
申请号 US20000617789 申请日期 2000.07.14
申请人 YAZAKI CORPORATION 发明人 SERIZAWA YASUYOSHI;KUBOTA MINORU
分类号 B60R16/02;H02G3/18;H05K1/00;(IPC1-7):H05K5/04 主分类号 B60R16/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利