| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which has a resin insulating layer, a filled via made through the insulating layer and filled with plating material and a conductor layer plated on the insulating layer and filled via, and in which the conductor layer has a uniform thickness, and also to provide a method for manufacturing the wiring substrate. SOLUTION: A wiring substrate 1 includes a first resin insulating layer 7, a first filled via 19 made through the first layer 7 and filled with plating material, and a second conductor layer 29 plated on the first layer and via. The second conductor layer 29 has a first electroplated layer 35 on its lower side, an upper surface 36 of which is etched. The second conductor layer 29 has a second electroplated layer 37 on its upper side which is formed as the surface of the second conductor layer 29, and which has a nearly constant thickness.
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