| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability and standardize a lead frame. SOLUTION: A semiconductor device comprises a plurality of inner leads 1b extending on the circumference of a semiconductor chip 2, a tape board 5 supporting the semiconductor chip 2 and joined to the end of the inner lead 1b, wires connecting a pad and the inner leads 1b formed on the main face 2c of the semiconductor chip 2, a sealing part formed by sealing the semiconductor chip 2 and the wires, and a plurality of outer leads continuing to the inner leads 1b and projected from the sealing part to the four-directional outside. The relation of the short side length (a) of the semiconductor chip 2 and the clearance (b) of the semiconductor chip 2 of the inner lead 1b whose edge part is most remote from the semiconductor chip 2 is a<=2b, a narrow pad pitch is contrived, the small semiconductor chip 2 can be mounted, and the standardization of the lead frame can be contrived. |
