| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which has a resin insulating layer, a filled via made through the insulating layer and filled with plating material and a conductor layer plated on the insulating layer and filled via, and in which the conductor layer has a uniform thickness, and also to provide a method for manufacturing the wiring substrate. SOLUTION: A wiring substrate 1 includes a first resin insulating layer 7, a first filled via 19 made through the first layer 7 and filled with plating material, and a second conductor layer 29 plated on the first layer and via. The second conductor layer 29 has an electrolessly plated layer 33 formed on the first insulating layer 7 and first filled via 19, and also has an electroplated layer 37 which is formed on the electrolessly plated layer and which contains nearly uniform-sized particles. |
