| 摘要 |
PROBLEM TO BE SOLVED: To contrive the miniaturization, thinning, cost reduction and decrease of the parasite inductance of a face mounting type semiconductor device. SOLUTION: The semiconductor device is provided with a semiconductor board 22, a plurality of electrodes such as collector electrodes 19a, 19b, a base electrode 20 and an emitter electrode 21 being the outside electrodes of a direct semiconductor device provided on only the rear face of the semiconductor board 22, a protection film 23 protecting the rear face of the semiconductor board of the electrode periphery, and resins 24, 25 coating at least one face of the other face except for the rear face. |
