METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board excellent in connection and reliability by forming solder bumps having uniform shape and height in which mutual short circuits are not caused. SOLUTION: This method for manufacturing a multilayer printed wiring board is provided with steps (a), (b) and (c). The step (a) is a first solder paste printing process wherein solder paste is printed at least one time, and recessed apertures for forming solder bumps are filled with solder paste. The step (b) is a solder paste flattening process wherein the surface of the solder paste buried by the process (a) is flattened. The step (c) is a second solder paste printing process wherein printing of solder paste is performed one or more times.