| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of electronic components high in mounting density and replacing a soldering method by efficiently performing insulation between conductors, in addition, arranging the connection part of the electronic components and the conductor so as to be easy to weld and assembling the conductors in the form of overlapping in the connection of the electronic components and the conductor. SOLUTION: The mounting structure has a plurality of electronic components 21-24 having lead terminals a-h, and conductors 6, 7, 8, 9 having connection parts A-H connected to the lead terminals a-h of the electronic component. The lead terminals of the electronic component and the connection parts of the conductors are arranged to weld the lead terminals and the connection parts. |
