| 摘要 |
PROBLEM TO BE SOLVED: To shorten a time needed for filling a resin into a cavity between a substrate and a flip chip packaged semiconductor component and a time needed for encapsulation. SOLUTION: A semiconductor component encapsulating method comprises following steps: (a) a step of applying a resin 3b on the circumference of the semiconductor component using a dispenser; (b) a step of hardening the resin by raising the temperature of the substrate or the semiconductor component 1 to the curing temperature of the resin 3, wherein the viscosity of the resin 3 may drop rapidly when the resin is curing so that the resin 3 is impregnated into the cavity; (c) a step wherein the air in the space surrounded with the resin 3 expands with heat and may escape from an air vent hole 3a, so that the resin 3 can spread over the whole space under the semiconductor component 1, an under fill is formed and the semiconductor component 1 is encapsulated. |
