| 摘要 |
<p>The invention concerns a method for making a stacked structure comprising at least a thin film adhering to a target substrate, comprising the following steps: a) forming a thin film from an initial substrate, the thin film having a free surface called first contact surface; b) placing in adhering contact the first contact surface with an intermediate support surface, the resulting structure being compatible with subsequent thinning of the initial substrate; c) thinning said substrate to expose a free surface of the thin film called second contact surface and facing the first contact surface; d) placing in adhering contact a surface of the target substrate with at least part of the second contact surface, the resulting structure being compatible with a subsequent removal of all or part of the intermediate support; e) removing at least part of the intermediate support to obtain said stacked structure.</p> |
