SOLDER BUMP FORMING APPARATUS AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a solder bump forming apparatus and solder bump forming method which can form effectively stable solder bumps. SOLUTION: The solder bumps are formed by printing solder paste on an electrode of a substrate 16 by using off-contact printing, and solder-bonding solder component on the electrode by reflow. A mask plate 17a is used in which pattern holes are arranged by an aperture pattern wherein an aperture area (e) of the pattern holes decreases toward the end portion side in a belt type range B in the vicinity of end portions of both sides parallel with a printing direction. Solder paste 22a is printed on the substrate 16 via the pattern hole 17d in a state that the mask plate 17a is pressed against the substrate 16 by a squeegee 21. As a result, the increase of printing amount which is caused by a phenomenon that the squeegee 21 is lifted up by a tensile force of the mask plate 17a is canceled by the aperture area, so that the solder paste can be printed with stable printing precision.