| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting system and an electronic component mounting method which enable more precise quality control effectively in the course of mounting. SOLUTION: This electronic component mounting system is constituted by combining a plurality of apparatuses M1-M7 for mounting electronic components, and manufactures a mounting board by mounting electronic components on a substrate by solder bonding. On the basis of solder position data obtained by a printing inspection apparatus and component position data obtained by a mounting state inspection apparatus, calibration for updating control parameters for controlling printing equipment and electronic component loading equipment is performed in a state of in-line, when a printing process, a solder position detecting process, a mounting process, a component position detecting process and a solder bonding process are individually performed in the course of electronic component mounting. As a result, the more precise quality control in the course of mounting is enabled effectively. |
