| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem of a prior art such that solder does not sufficiently permeate into a through hole and imperfect soldering is caused in a soldering part of a surface mount device when soldering of a printed board is performed by using the conventional jet solder tank equipped with a jet nozzle. SOLUTION: In this soldering method of a printed board, a incoming jet nozzle port for jetting solder in the incoming direction of a running printed board and a following jet nozzle port for jetting solder in the following direction are formed in a primary jet nozzle, and soldering is performed by selecting the nozzle port suitable for the state of a soldering part of the printed board. In this jet solder tank, each of the incoming jet nozzle port and the following jet nozzle port is a slit type, and a turbulent flow forming means and a switching valve are installed in a lower part. |
